Equipment front-end module for 200 mm wafers.

• The equipment can be connected to OHT or AGV.
• Wafer holding is basically vacuum suction or edge-clamp.
• The internal mini-environment cleanliness control is verified by the CFD analysis, which ensures the internal and external pressure-differential design to prevent from pollution during the wafer transfer process.
• The compact design can reduce footprint and saves costs.
• Optimized moving track of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route.
• LOAD PORT configuation capability from 2 to 4 ports.
• Optional with the high-speed wafer pre-aligner, which uses the dynamic image algorithm, can accurately and quickly allocate the wafer center and direction.
• Optional with the optical and image processing & identification system,enhances the identification rate of wafer ID.
• Complete data track to satisfy the requirement of predictive maintenance of Industry 4.0.
• Customized services, discussions for customized specifications.