200mm

• Simultaneously correspond to the transfer of 8" & 12" wafers

• Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.

• Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route

• The ultra-high speed wafer aligner, which uses the dynamic image algorithm to allocate the wafer center and direction accurately and quickly.

• Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.

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