Simultaneously correspond to the transfer of 8" & 12" wafers
Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.
Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route
The ultra-high speed wafer aligner, which uses the dynamic image algorithm to allocate the wafer center and direction accurately and quickly.
Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.