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DLR-F211V10 Series

供應情形: 有現貨

型號: B300

300mm
  • Fixed wafer transfer process with vacuum and edge-clamp types available to customers depending on actual needs.

  • Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.

  • Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route.

  • Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.

 
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